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- Part Number Suffix Designations:
- 8-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil
- 14-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil
- 28-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil
- 18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
- 28-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
- 28-Lead Ceramic Dual In-line with Window (JW) –600 mil (CERDIP)
- 40-Lead Ceramic Dual In-line with Window (JW) – 600 mil (CERDIP)
- 68-Lead Ceramic Leaded (CL) Chip Carrier with Window –Square (CERQUAD)
- 3-Lead Plastic Transistor Outline (TO) (TO-92)
- 3-Lead Plastic Small Outline Transistor (TT) (SOT23)
- 5-Lead Plastic Small Outline Transistor (OT) (SOT23)
- Leadless Wedge Module Plastic Small Outline Transistor (WM) (SOT385)
- 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
- 14-Lead Plastic Dual In-line (P) –300 mil (PDIP)
- 16-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
- 18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
- 20-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
- 24-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
- 24-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)
- 28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)
- 28-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
- 40-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
- 64-Lead Shrink Plastic Dual In-line (SP) – 750 mil (PDIP)
- 20-Lead Plastic Leaded Chip Carrier (L) –Square (PLCC)
- 28-Lead Plastic Leaded Chip Carrier (L) –Square (PLCC)
- 32-Lead Plastic Leaded Chip Carrier (L) – Rectangle (PLCC)
- 44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
- 68-Lead Plastic Leaded Chip Carrier (L) –Square (PLCC)
- 84-Lead Plastic Leaded Chip Carrier (L) –Square (PLCC)
- 8-Lead Plastic Small Outline (SN) –Narrow, 150 mil (SOIC)
- 14-Lead Plastic Small Outline (SL) –Narrow, 150 mil (SOIC)
- 16-Lead Plastic Small Outline (SL) –Narrow 150 mil (SOIC)
- 8-Lead Plastic Small Outline (SM) – Medium, 208 mil (SOIC)
- 16-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
- 18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
- 20-Lead Plastic Small Outline (SO) –Wide, 300 mil (SOIC)
- 28-Lead Plastic Small Outline (SO) –Wide, 300 mil (SOIC)
- 8-Lead Plastic Micro Leadframe Package (MF) 6x5 mm Body (MLF-S)
- 8-Lead Plastic Micro Leadframe Package (MF) 6x5 mm Body (MLF-S)
- 28-Lead Plastic Micro Leadframe Package (MF) 6x6 mm Body (MLF)
- 28-Lead Plastic Micro Leadframe Package (MF) 6x6 mm Body (MLF)
- 8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
- 20-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
- 28-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
- 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
- 14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
- 20-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
- 28-Lead Plastic Thin Small Outline (TS) –5 x 20 mm (TSOP)
- 28-Lead Plastic Very Small Outline (VS) – 8 x 13.4 mm (VSOP)
- 44-Lead Plastic Metric Quad Flatpack (PQ) 10x10x2 mm Body, 1.6/0.15 mm Lead Form (MQFP)
- 44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
- 64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
- 80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
- 100-Lead Plastic Thin Quad Flatpack (PT) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
- Product Tape and Reel Specifications
- THERMAL CHARACTERISTICS
- THERMAL RESISTANCE
- Introduction
- Product Integrity
- Ordering Information
- ELECTRICAL SPECIFICATIONS
- QTP
- EPROM
- EEPROM
- ROM
- DIE MECHANICAL SPECIFICATIONS
- Bond Pad Coordinates
- Substrate Bonding
- Shipping Options
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《IC芯片技术指南》电子版下载
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